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Home Forums 68kMLA Desoldering large I/O components — #9
Post #9 by tt
Source Forum68kMLA
CategoryPeripherals
Post DateSun, 15 Mar 2009 - 19:28
Original URLhttps://68kmla.org/bb/threads/desoldering-large-i-o-components.16805/
Post
I tried chip-quik and it did not work. I kind of figured it wouldn't I guess it was wishful thinking.

I do like the idea of using a heat gun. I was trying this out yesterday with a heat-shrink gun. The component was starting to get loose in some areas, toward the ends, but not in the middle. I had the board in a vise and had all the components upright since I didn't want any to fall out. There are no adjustable controls, so the gun might not be getting quite hot enough.

Trag, when you suggest molding clay, do you mean the oil based kind? Does it get messy, especially after heating?

mp.ls