Hmmm...Mac128, I'll keep in mind what you said about surface mount stuff, for my Centris and such. But for now, let's focus on my pre-SE/30 machines, namely the SEs and the 512k. (And the Apple IIc, but I'm not too worried about that one right now.)

First of all, assuming I clip a capacitor off the board and all that, is there lead present there on that surface?

Because then, all I'd have to do is to melt on a blob of lead-free solder big enough to cover the lead, so even if the lead did melt, it would be covered by the lead-free. (For instance, comparing solder joints on the back of a logic board to those on the back of an analog board--the analog board uses much bigger 'blobs' of solder.)

Then, with my newly lead-freed joint, I'll be able to heat up both surfaces and get it all to melt together. Or else I can find some sort of conductive glue, then just glue little bits of metal to the leaded joints, and then melt everything else on top of that...I dunno. I'm working on it. I'm still trying to think of ways to do this, taking into account what you have said so far.

Anyway, thanks for your comments. I'll think of something!

-Apostrophe