Yeah, they're really different beasts
- Faulty iBook G4 chip: about ten legs, repaired easily enough
- Faulty iBook G3 video chipset: about three hundred, inaccessible
I can't imagine the "heat gun" method (which I've tried to some success on an iBook 800 - nut need to do it again) would actually melt the solder on the BGA array, but rather slightly expand the PCB due to the heat and when it cools down, it contracts making for a more reliable connection - kind of "resetting" the flex in the board.
JB
- Faulty iBook G4 chip: about ten legs, repaired easily enough
- Faulty iBook G3 video chipset: about three hundred, inaccessible
I can't imagine the "heat gun" method (which I've tried to some success on an iBook 800 - nut need to do it again) would actually melt the solder on the BGA array, but rather slightly expand the PCB due to the heat and when it cools down, it contracts making for a more reliable connection - kind of "resetting" the flex in the board.
JB