I can't imagine the "heat gun" method (which I've tried to some success on an iBook 800 - nut need to do it again) would actually melt the solder on the BGA array, but rather slightly expand the PCB due to the heat and when it cools down, it contracts making for a more reliable connection - kind of "resetting" the flex in the board.

Click to expand...

I tried this on an iBook G4 exhibiting strange issues, but before I did I decided to try it on a dead PC motherboard. What I found is that the heat gun, hot enough (had to use maximum power for a few seconds) can in fact melt the solder under the chip. I managed to successfully remove a few BGA chips that way. The trick though is to apply the heat for just the exact amount of time and to not apply any downward force to the chip, otherwise the solder below could turn into a single massive pool of solder... and the board's toast at that point.

Of course you'd never know until you power it up and let all the magic smoke out, so it's a pretty risky operation overall. Thankfully my attempt went perfectly the first time, although it was pretty much all trial and error.

Anyway, back onto this iBook... we're up to day 2 now since the repair and the machine has yet to exhibit any strange behaviour. I thought i'd lost it again today, since it dropped into a black screen with only a backlight, but it turned out to just be Front Row starting up. :lol: All in all, it's fine! I'm satisfied that this iBook is fighting fit.

Now I just need to order a set of new rubber feet for it to make it all nice and new again.

Cheers

- Michael