I have to admit... agreed. I'd never just apply the glue straight on. After reflowing the legs of the chip, all I did was to apply the glue to a known dead iBook logic board to form the basis for the "mould". Once set over that, I removed it from the dead board and carefully lay it in position on the good iBook board- this gives it the extra bracing needed to support the chip whether it's reflowed or not (although applying it after the reflow will somewhat help prevent it cracking from heat again).
Was surprised I didn't rip the chip from the board when removing it from the scrap board actually... they hold down tougher than I thought. I fixed that old board too, but I want to see how long it lasts without being reflowed first. That one is my "test iBook".