Phreakout, you are perpetuating an urban legend, most likely started by a disgruntled Andy hertzfeld or Daniel Kottke whom Jobs had denied stock options. There was no heat problem with the Apple III, Jerry Manock proved this with extensive tests and cleared his name at the time. The problem with the III was entirely related to the logic board. Again I ask, how did they produce a fully functional Iii a year later without fans and prevent the chips from continuing to pop out? The answer is, there was never a heat problem to begin with. Most of the chips came out of ill-fitting, loose sockets during shipping. Later IIIs used higher quality sockets and gold connections. It was this that caused the normal heating and cooling of any computer (even one with a fan) to contribute to chips working their way out of their sockets. As for a board full of sockets, there are definitely items that are better soldered to a board than socketed.