Can you describe in good detail what you did as far as washing the board in a dishwasher? I'm intrigued to maybe try it myself. Since I started this recapping business, I've been a bit fearful of damaging boards using this cleaning process, so I resorted to using a small wire brush and pick kit (you can get them at Radio Shack, btw; small yellow handle tools and a plastice bag) along with a bit of Isopropyl Rubbing Alcohol and lots of Q-Tips.
One interesting note, though. Apple, along with many other electronics manufacturers in the 1980s or 1990s, must have switched to a different type of solder. The mixture seems to need more heat in order to melt and is a bit cloudy, almost a light or darker gray cloudy color to it. This is part of the reason why it is so hard to remove lead-through-PCB components. That and the holes drilled into the PCB are smaller in diameter than what they ought to be.
yoyomac, this paragraph comment is in regard to the 3rd from the last sentence in the paragraph, about 2 posts ago. That is where I recommend using chip sockets for anything that is a genuine chip (IC) or looks like one (like RP2). I don't know where Apple went wrong by not putting sockets on their boards for every single IC, but that just makes my job more tedious to complete. With sockets, there's no need to desolder the old component out and resolder the new one in place; just pull out the old part and slip the new one in. Takes less than a minute to do.
Sorry, just one of my biggest gripes when it comes to electronics design. I guess they neglected this simple step after the Apple III debacle. Well, it wouldn't have happened if Jobs had allowed cooling fans be added to every single computer built. Woz was right all along. He thought these simple details out ahead of time, so he wouldn't have to deal with fixing it later. Why spend all your time fixing a hardware problem when you could be using the computer. A perfect example: The Apple II/II+/IIe.
That's my $.02. I'll get off my soap box for now.
73s de Phreakout. :rambo:
One interesting note, though. Apple, along with many other electronics manufacturers in the 1980s or 1990s, must have switched to a different type of solder. The mixture seems to need more heat in order to melt and is a bit cloudy, almost a light or darker gray cloudy color to it. This is part of the reason why it is so hard to remove lead-through-PCB components. That and the holes drilled into the PCB are smaller in diameter than what they ought to be.
yoyomac, this paragraph comment is in regard to the 3rd from the last sentence in the paragraph, about 2 posts ago. That is where I recommend using chip sockets for anything that is a genuine chip (IC) or looks like one (like RP2). I don't know where Apple went wrong by not putting sockets on their boards for every single IC, but that just makes my job more tedious to complete. With sockets, there's no need to desolder the old component out and resolder the new one in place; just pull out the old part and slip the new one in. Takes less than a minute to do.
Sorry, just one of my biggest gripes when it comes to electronics design. I guess they neglected this simple step after the Apple III debacle. Well, it wouldn't have happened if Jobs had allowed cooling fans be added to every single computer built. Woz was right all along. He thought these simple details out ahead of time, so he wouldn't have to deal with fixing it later. Why spend all your time fixing a hardware problem when you could be using the computer. A perfect example: The Apple II/II+/IIe.
That's my $.02. I'll get off my soap box for now.
73s de Phreakout. :rambo: