Depends on if there is a stencil available.
I have the stencils for an EBGA64 as that was a VERY common flash IC i used to pull, reprogram and stick back into a device. I also have the programmer/adapter for EBGA64 Flash ICs.
But anyway... I dont have the stencils to reball for any other type of layout. if the IC is already pre-balled then its real easy to align and reflow to mount.
Otherwise, you have to reball the IC which takes a stencil.
as far as equipment, I am cheap so i do things the redneck way. I use a toaster oven to pre-heat the board, and then use a heatgun to bring the IC into reflow.
i use the heatgun and an aluminum plate for reballing, but its easier to use a stencil, alignment bracket, and preformed balls. With a hotplate. thats the best way, but i dont have that setup. just a machined block to be used with solder paste and a heatgun for EBGA64.
I have the stencils for an EBGA64 as that was a VERY common flash IC i used to pull, reprogram and stick back into a device. I also have the programmer/adapter for EBGA64 Flash ICs.
But anyway... I dont have the stencils to reball for any other type of layout. if the IC is already pre-balled then its real easy to align and reflow to mount.
Otherwise, you have to reball the IC which takes a stencil.
as far as equipment, I am cheap so i do things the redneck way. I use a toaster oven to pre-heat the board, and then use a heatgun to bring the IC into reflow.
i use the heatgun and an aluminum plate for reballing, but its easier to use a stencil, alignment bracket, and preformed balls. With a hotplate. thats the best way, but i dont have that setup. just a machined block to be used with solder paste and a heatgun for EBGA64.