This is why people should just recap and not play with their compacts before they do so, you never know what might happen with cap goo sitting around, slowly eating through traces, vias, IC legs, etc...

I would imagine electricity actually moving along/through the cap goo could possibly amplify the corrosive properties of the goo several orders of magnitude just due to energy now being provided to accelerate a chemical reaction.

It would be an interesting technoarcheology research project, does using the mac with cap goo leakage present actually accelerate the rate of goo destruction of a motherboard and/or increase the potential for a catastrophic component/system failure?