So, having watched that video of desoldering with a clothes iron, my impression is that I would be very leery of using that method on a card I intended to use again afterwards. It just seems too fast, too likely to cause bad solder joints elsewhere on the device. Any thoughts, folks?

I have a flat waffle iron here I am planning to put into service for this kind of thing, but not before adding a more accurate and adjustable thermostat. I always thought best practice was to heat the PCB to just below solder melt, so a quick tap per joint with the iron is all it takes.

There's a couple of good articles on toaster oven reflow in Silicon Chip http://www.siliconchip.com.au . There's a recommended heat up, hold, and cool down curve over time for solder, a different one for leaded and lead-free, to ensure good, reliable joints. In the first article, they monitored the temp by eye with a thermocouple and multimeter, and it rose and fell comfortably within the curve. The second article is about adding a microcontroller driven thermostat/timer, which is now available as a kit ($80 :-/ ) - probably from http://www.jaycar.com.au.

Sorry, posting from my phone again, so I can't check those links.